Product Overview

The Ceramic Substrate Laser Cutting Machine is a precision laser processing system for cutting ceramic substrates, brittle materials, and thin metal sheets used in semiconductor packaging, power electronics, and electronic manufacturing.

Cutting Performance

Clean Edges for Brittle Materials
Non-contact laser cutting reduces mechanical stress, minimizing cracks, chipping, and edge damage on ceramic substrates and fragile materials.

Complex Shape Cutting
The CNC motion system supports straight lines, curves, slots, holes, and customized contours required in electronic components and precision parts.

Material Capability

Advanced Ceramic Materials
The machine processes ceramic materials used in electronic and semiconductor applications, including:

Alumina (Al₂O₃)
Aluminum Nitride (AlN)
Zirconia (ZrO₂)
Silicon Nitride (Si₃N₄)
Silicon Carbide (SiC)
DBC ceramic substrates
DPC ceramic substrates
AMB ceramic substrates

Brittle Materials
The laser system supports processing of brittle materials where mechanical cutting creates high risk of cracking or edge defects, including:

Sapphire
Quartz
Optical glass
Silicon wafers

Thin Metal Materials
The equipment also processes thin precision metal materials used in electronic assemblies:

Copper
Stainless steel
Aluminum
Nickel-titanium alloy

Precision Control System

Accurate Positioning Control
The machine provides X/Y axis repositioning accuracy of ±5 μm, supporting precision cutting applications where dimensional consistency is required.

Vision Positioning Integration
Optional CCD vision positioning systems support alignment of ceramic substrates before cutting, improving processing accuracy for products with strict positioning requirements.

Automated Production Integration
The equipment supports integration with loading systems, unloading systems, inspection equipment, and factory production communication systems for automated manufacturing lines.

Production Applications

Semiconductor Packaging
Used to cut ceramic carriers, semiconductor substrates, and heat dissipation plates requiring precise dimensions and controlled edge quality.

Power Electronics Manufacturing
Used to process DBC, DPC, and AMB substrates for IGBT modules and power electronic devices requiring stable insulation performance.

Electronic Component Production
Used to cut ceramic circuit boards, insulation parts, and precision ceramic components with customized shapes, slots, and micro structures.

New Energy Equipment Manufacturing
Used to process ceramic and metal components for power control systems, battery equipment, and thermal management assemblies requiring consistent precision.

Machine Specifications

Parameter	Specification
Model	HT-PFC3030
Laser Power	1000W
Laser Wavelength	1060–1080nm
X/Y Repositioning Accuracy	±5 μm
Processing Speed	5000–25000 mm/s
Maximum Acceleration	1G
Processing Area	300 × 300mm / 600 × 600mm
Machine Dimensions	1250 × 1250 × 1800mm

FAQ

Q: How is cutting quality verified before shipment?

A: Each machine undergoes laser output testing, motion accuracy inspection, system function testing, and sample cutting verification before delivery. Cutting results are checked for edge condition, dimensional accuracy, and process stability.

Q: Can customers test their own ceramic materials?

A: Yes. Customers can provide ceramic samples or drawings for cutting evaluation before equipment confirmation. Testing results are used to verify material compatibility and process parameters.

Q: What information is required for machine selection?

A: The evaluation requires ceramic material type, thickness, substrate size, cutting pattern, required accuracy, and production volume.

Q: Does the machine support customized configurations?

A: Customization options include working area, laser source configuration, vision positioning, fixtures, automation loading systems, and production line integration.

Q: What documents are provided for export shipment?

A: Standard export documents include commercial invoice, packing list, bill of lading, and certificate of origin.